Part Number | 514-AG11D-ES |
Main Category | Connectors, Interconnects |
Sub Category | Sockets for ICs, Transistors |
Brand | Integrated Device Technology (IDT) |
Description | CONN IC DIP SOCKET 14POS GOLD |
Series | 500 |
Packaging | Tube |
Type | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 14 (2 x 7) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 25µin (0.63µm) |
Contact Material - Mating | Copper Alloy |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | - |
Contact Material - Post | Copper Alloy |
Housing Material | Polyester |
Operating Temperature | -55°C ~ 125°C |
Image |
514-AG11D-ES
IDT, Integrated Device Technology Inc
4259
0.88
Iconix Inc.
514-AG11D-ES
Integrated Device Technology (IDT)
58168
1.385
Digchip Technology Co.,Limited
514-AG11D-ES
IDT (Integrated Device Technology)
5000
1.89
Beam Technology Co.,Ltd